EBX671-521 8th/9th Gen Core i7, i5, i3 Wide-Temperature Fanless Embedded System

$1,835.00 + Tax

• Processor: 8th/9th Gen Core i7, i5, i3
• Memory: 8 GB DDR4 (64GB max)
• SSD: 128GB
• Expansion:
○ 2 x Full-size PCI Express Mini Card slot (USB + PCIe signal)
○ 2 x SIM slot
○ 1 x MXM3.1 type A connector

• Ethernet: 4 x POE, 2 x 10/100/1000 Mbps
• Display:1 x HDMI, 1 x DisplayPort, 1 x DVI-I
• MXM: 2 x DisplayPort via optional MXM kit
• COM: 2 x RS-232/422/485
• USB: 4 x USB 3.1, 2 x USB 3.0
• Fanless Cooling System

• Operating Temperature: -40°C to +50°C
• Operating System: Windows 10 Professional

Mounting Options

WiFi and Bluetooth Kit

Operating systems

Memory Options *

Processor *

Solid State Drive (SSD) – Wide Temperature (Primary) *

Solid State Drive (SSD) – Wide Temperature (Secondary)

Keyboard / Mouse (USB)

Monitor

Power

Software

Warranty

Product price
+ Tax
Additional options total:
+ Tax
Order total:
+ Tax

Description

General

Model EBX671-521
Color Silver

Expansion Configuration

PCIe 2 x Full-size PCI Express Mini Card slot (USB + PCI Express signal)
SIM slots 2 x SIM slot
MXM 1 x MXM3.1 type A connector

Processor

CPU 8th/9th gen Intel Core i7/i5/i3 processors (35W/65W)
CPU Socket LGA1151
Chipset Q370

System Memory

Standard RAM 8GB
Maximum RAM 64GB
RAM Type DDR4
RAM Socket 2 x 260-pin non-ECC SO-DIMM

Operating System

Supported Operating Systems Windows 10 Professional

Hard Drive

SSD 128 GB SSD

System Power

Power Connection
1 x Phoenix type VDC power input connector
Power Input 24 VDC
Power Protection OVP (over voltage protection) UVP (under voltage protection) OCP (over current protection) SCP (short circuit protection) Reverse protection

BIOS

BIOS Type AMI

Graphics

GPU Interface 1 x HDMI, 1 x DP, 1 x DVI-I (2 x DisplayPort via optional MXM kit)

USB

USB 3.1 4x USB 3.1
USB 3.0 2x USB 3.0

I/O

 

Ethernet 4 x PoE (IEEE802.2at), up to 60W; 2 x 10/100/1000 Mbps Ethernet (Intel i210-IT & i219-LM)
Serial 2 x RS-232/422/485
Flexible I/O Window 1 x Flexible I/O window (Default : 2 x DB9 half-cut bracket)

System Chassis Characteristics

 

Construction Aluminum Extrusion and Heavy-Duty Steel with IP40 Protection
Drive Capacity 2 x SATA HDD drive bay (max. up 15 mm height & RAID 0 & 1); 1x mSATA
Front Panel Indicators 1 x Green LED for system power-on
1 x Green LED for HDD active
4 x Green LED for programmable
Front Panel Controls 1 x AT/ATX quick switch
1 x ATX power switch
1 x Reset switch
1 x Remote switch
Cooling Fans None
TPM TPM 2.0
Watchdog Timer 255 levels, 1 ~ 255 sec.
Wifi Antennae Port 4 x SMA-type antenna connector
Operating Temperature Without MXM module:
-40°C – 60°C (-40°F to +140°F) (with WT DRAM/SSD, CPU TDP 35W)
-40°C – 50°C (-40°F to +122°F) (with WT DRAM/SSD, CPU TDP 65W)
With MXM module:
-40°C – 50°C (-40°F to +122°F) (with WT DRAM/SSD/
MXM kit, CPU TDP 35W)
Shock IEC 60068-2-27 (with SSD: 50G, half sine, 11 ms duration)
Relative Humidity 10% to 90%, non-condensing
Vibration Resistance IEC 60068-2-64 (with SSD: 3Grms STD, random, 5 – 500 Hz, 1 hr/axis)
Weight (Net/Gross) 4.8 kg (10.58 lb)/5.6 kg (12.34 lb)
Dimensions 280 mm (11.2″) (W) x 210 mm (8.26″) (D) x 80.5 mm (3.16″) (H)
Certifications CE, FCC Class A

Additional information

Weight 4.31 lbs
Processor
6th Gen Core I Series
7th Gen Core I Series
Microsoft Windows Support
Chipset
Intel Q170
Socket
LGA1151
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